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| Categories | Printed Circuit Board Design | 
|---|---|
| Place of Origin: | China | 
| MOQ: | Negotiable | 
| Price: | Negotiable | 
| Payment Terms: | T/T | 
| Supply Ability: | 100000pc/Month | 
| Delivery Time: | 4 Weeks | 
| Packaging Details: | PCB + Box | 
| Brand Name: | CUSTOM MADE | 
| Certification: | ISO/UL | 
| Keyword: | Printed Circuit Board Design | 
| Surface Finished: | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp,Immersion Gold+OSP | 
| PCB Boards: | POP boards, Normal Boards, FPC boards, Rigid-flex boards, Metal base boards | 
| Special Capability: | Gold Finger Plating,Peelable,Carbon ink | 
| Applications: | Electronics Device, Consumer Electronics, Electronical products, Industrial | 
| Materials: | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 | 
| Copper Thickness: | 0.3-12 oz | 
| Min BGA Footprint: | 03015 Chip/0.35mm BGA | 
| Payment Method: | T/T | 
| Whether to Support customization: | Support | 
| Logistics: | Accept customer specified logistics | 
| Company Info. | 
| TONGZHAN INDUSTRIAL LIMITED | 
| View Contact Details | 
| Product List | 
Printed Circuit Board Design Blind Hole Plate Carbon Ink High - Tg FR4
Printed Circuit Board Design Description:
1. PCB design type: High-Speed, Analog, Digital-analog Hybrid, High Density/Voltage/Power, RF, Backplane, ATE, Soft Board, Rigid-Flex Board, Aluminum Board, etc.
2. Design tools: Allegro, Pads, Mentor Expedition.
Printed Circuit Board Design Parameters:
| Item | Technical Parameter | 
| Layer | 2-64 | 
| Thickness | 0.5-17.5mm | 
| Copper Thickness | 0.3-12 oz | 
| Min Mechanical Hole | 0.1mm | 
| Min Laser Hole | 0.075mm | 
| HDI | 1+n+1,2+n+2,3+n+3 | 
| Max Aspect Ratio | 20:01 | 
| Max Board Size | 650mm*1130mm | 
| Min Width/Space | 2.4/2.4mil | 
| Min Outline Tolerance | ±0.1mm | 
| Impedance Tolerance | ±5% | 
| Min PP Thickness | 0.06mm | 
| Bow &Twist | ≤0.5% | 
| Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 | 
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP | 
| Special Capability | Gold Finger Plating, Peelable, Carbon ink | 
Printed Circuit Board Design Introduction:
1. High density possible
Over the years, the high density of printed boards has been able to
develop correspondingly with the improvement of integrated circuit
integration and the advancement of mounting technology.
2. High reliability
Through a series of technical means such as inspection, testing,
and aging tests, the PCB can be guaranteed to work reliably for a
long time (usually 20 years).
3. Designability
Requirements for various properties of PCB (electrical, physical,
chemical, mechanical, etc.) can be achieved through design
standardization, normalization, etc. In this way, the design time
is short and the efficiency is high.
4. Producibility
PCB adopts modern management, which can realize standardization,
scale (quantization), and automatic production, so as to ensure the
consistency of product quality.
5. Testability
A relatively complete test method and test standard have been
established, and the qualification and service life of PCB products
can be detected and identified through various test equipment and
instruments.
6. Assemblability
PCB products not only facilitate the standardized assembly of
various components but also enable automated and large-scale mass
production. In addition, the overall assembly of the PCB and
various other components can also form larger components, systems,
and even complete machines.

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