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Categories | Turnkey PCB Assembly |
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Place of Origin: | China |
MOQ: | Negotiable |
Price: | Negotiable |
Payment Terms: | T/T |
Supply Ability: | 100000pc/Month |
Delivery Time: | 4 Weeks |
Packaging Details: | PCB + Box |
Brand Name: | CUSTOM MADE |
Certification: | ISO/UL |
Keyword: | Turnkey PCB Assembly |
Applications: | Industrial Control, Automotive Electronics, Communications |
Materials: | High-Tg FR4, Nelco, RCC, FR4 |
Service: | Fast turnkey PCB assembly |
PCB boards: | FPC Board, Rigid-Flex Board, Metal Substrate Boards |
Max Board Size: | 650mm*1130mm |
Surface Finished: | HASL Pb Free Immersion Gold Osp |
Min PP Thickness: | 0.06mm |
Payment Method: | T/T |
Whether to Support customization: | Support |
Logistics: | Accept customer specified logistics |
Company Info. |
TONGZHAN INDUSTRIAL LIMITED |
View Contact Details |
Product List |
One-Stop Turnkey PCB Assembly Conformal Coating Carbon Ink HASL High Multilayer
Turnkey PCB Assembly Description:
In terms of product solutions, we support flexible supply, and one-stop service for SMT, post-soldering, assembly, and testing. There are various types of PCB boards: POP boards, ordinary boards, FPC boards, rigid-flex boards, and metal substrates. At the same time, we have the smallest components (such as 01005), and we are also a cooperative supplier that precisely matches the best strategy.
Turnkey PCB Assembly Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction:
1. Provide mechanical support for fixing and assembling various
electronic components such as integrated circuits, realize wiring,
and electrical connection or electrical insulation between various
electronic components such as integrated circuits, and provide
required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide
identification characters and graphics for component insertion,
inspection, and maintenance.
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