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Categories | One Stop PCB Assembly |
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Place of Origin: | China |
MOQ: | Negotiable |
Price: | Negotiable |
Payment Terms: | T/T |
Supply Ability: | 100000pc/Month |
Delivery Time: | 4 Weeks |
Packaging Details: | PCB + Box |
Brand Name: | CUSTOM MADE |
Certification: | ISO/UL |
Keyword: | One Stop PCB Assembly |
PCB boards: | Thick Copper and Aluminum Boards, Metal Substrate Boards, Multi-Layer Boards |
Applications: | Automotive Electronics, Internet |
Special Capability: | Peelable, Carbon ink, Gold Finger Plating |
Min BGA Footprint: | 03015 Chip/0.35mm BGA |
Min PP Thickness: | 0.06mm |
Materials: | Nelco,RCC,PTFE, M4, M6,TU862 |
Parts SMT Accuracy: | ±0.04mm |
Payment Method: | T/T |
Whether to Support customization: | Support |
Logistics: | Accept customer specified logistics |
Company Info. |
TONGZHAN INDUSTRIAL LIMITED |
View Contact Details |
Product List |
One-Stop PCB Assembly Maintainability Rigid-Flex Boards High - Tg FR4 HASL
One-Stop PCB Assembly Description:
1. Quick-turn and flexible delivery
2. Support a wide range of PCBs: high-layer, multi-layer,
rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection
standard.
One-Stop PCB Assembly Parameters:
Item | Technical Parameter |
Layer ,Number of layers | 2-64 |
Thickness | 0.5-17.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
One-Stop PCB Assembly Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
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