Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding

Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS

The IC Chip tray is a carrier used by semiconductor chip enterprises for packaging and baking test of their chips. Compared with other traditional packaging methods, it can not only place very small components or parts, but also can improve the actual use of the product matched with accessories lid and clamps.

From the design drawings, mold manufacturing, product manufacturing to cleaning and packaging and so on. All steps and operations are under strict quality control, we take customer satisfaction products as the ultimate goal.Constantly meet customer requirements to promote our factory to a higher level of progress.

Details of the HN21120 Waffle Pack

This HN21120 waffle pack is made of PC. It is light in weight and strong in texture, which can effectively protect customers products. At the same time,10*15 matrix design can accommodate more customers' products. It can meet customers' different requirements for sample and mass production loading separately.

The production not only requires high requirements in the process of transportation and transfer, but also needs to deal with the turning over of automation equipment. Our company has accumulated a lot of experience in the production of this kind of products, which can fully meet the diversified needs of customers and provide design, production integrated packaging scheme.

Service of the HN21120 Chip Tray

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans:Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Ans:Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
Ans:We can send you them right now if you are interested in something we have stock.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/