16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness

Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness

PCB Specifications:

1 Part NO: Multi-Layer PCB0025

2 Layer Count: 16 Layer PCB

3 Finished Board Thickness: 2.0MM

4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1

5 Min Lind Space&Width: 3/3mil

6 Application Area: Industrial Control

Material Data Sheet:

S1130
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	135
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	310
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	65
			After Tg	ppm/℃	310
			50-260℃	%	4.5
T260		IPC-TM-650 2.4.24.1	TMA	min	13
T288		IPC-TM-650 2.4.24.1	TMA	min	<1
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	60S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	4.8E + 08
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.6E + 06
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	5.2E + 07
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	5.3E + 06
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	120
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	60
Electrical Strength		IPC-TM-650 2.5.6.2	D-48/50+D-4/23	kV/mm	—
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.6
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.016
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength(1oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.8
			125℃	N/mm	1.6
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	600
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	500
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.15
CTI		IEC30112	C-48/23/50,	℃	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Layer Stackup:

Layer No.	Layer Type	Di-electric (Prepreg/ Core)	Di-electric constant	Processed Thickness (mil)	Target Impedance - Single Ended (+/- 10%)	Trace Width (Single ended) (mil)	Target Impedance – differential (+/- 10%)	Trace Width/ separation (differential pair) (mil)
		MASK	4.0	2.0
1	TOP	Copper Foil 12 microns		1.772	50 ohm 55 ohm	7 6	100ohm 95ohm 90ohm	5-8-5 5-6.5-5 5-5.5-5
		PrepreG	3.23	2.101
		PrepreG	3.23	2.101
2	GND	Copper		0.689
		CORE	3.37	3.9
3	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
4	GND	Copper		0.689
		CORE	3.37	3.9
5	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
6	GND	Copper		0.689
		CORE	3.37	3.9
7	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
8	GND	Copper		0.689
		CORE	3.37	3.9
9	POWER	Copper		2.638
		PrepreG	3.23	0.788
		PrepreG	3.23	0.788
10	GND	Copper		2.638
		core	3.37	3.9
11	POWER	Copper		2.638
		PrepreG	3.23	0.788
		PrepreG	3.23	0.788
12	POWER	Copper		2.638
		core	3.37	3.9
13	GND	Copper		0.689
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
14	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		CORE	3.37	3.9
15	GND	Copper		0.689
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
16	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		CORE	3.37	3.9
17	GND	Copper		0.689
		PrepreG	3.23	1.86
		PrepreG	3.23	1.86
18	SIGNAL	Copper		0.689	50 ohm 55 ohm	4 3.75	100ohm 95ohm 90ohm	4-7-4 4-6-4 4-4.5-4
		CORE	3.37	3.9
19	GND	Copper		0.689
		PrepreG	3.23	2.101
		PrepreG	3.23	2.101
20	SOLDER	Copper Foil 12 microns		1.772	50 ohm 55 ohm	7 6	100ohm 95ohm 90ohm	5-8-5 5-6.5-5 5-5.5-5
		MASK		2.0

Product Tags:

16 Layer Multilayer Circuit Board

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