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RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-181.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
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RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm


RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.


RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.


The benefits of RF-10 laminates. It has excellent adhesion to smooth coppers, high thermal conductivity for enhanced thermal management, high DK for RF circuit size reduction and low 0.0025 loss tangent @ 10 GHz etc.




The RF-10 has a wide range of applications. Includiing aircraft collision avoidance systems, GPS antennas, microstrip patch antennas, passive components (filters, couplers, power dividers) etc.


Our PCB Capability (RF-10)

PCB Material:Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation:RF-10
Dielectric constant:10.2
Dissipation Factor0.0025 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..


RF-10 Typical Values

PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 Mod.10.2 ± 0.310.2 ± 0.3
Df @ 10 GHzIPC-650 2.5.5.5.1 Mod.0.00250.0025
TcK (-55 to 150 °C)IPC-650 2.5.5.6ppm/°C-370ppm/°C-370
Moisture AbsorptionIPC-650 2.6.2.1%0.08%0.08
Peel Strength (1 oz. RT copper)IPC-650 2.4.8 (solder)lbs/in10N/mm1.7
Volume ResistivityIPC-650 2.5.17.1Mohm/cm6.0 x 107Mohm/cm6.0 x 107
Surface ResistivityIPC-650 2.5.17.1Mohm1.0 x 108Mohm1.0 x 108
Flexural Strength (MD)IPC - 650 - 2.4.4psi14,000N/mm296.53
Flexural Strength (CD)IPC - 650 - 2.4.4psi10,000N/mm268.95
Tensile Strength (MD)IPC - 650 - 2.4.19psi8,900N/mm262.57
Tensile Strength (CD)IPC - 650 - 2.4.19psi5,300N/mm237.26
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (25 mil-MD)-0.0032% (25 mil-CD)-0.0239
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (25 mil-MD)-0.0215% (25 mil-CD)-0.0529
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (25 mil-MD)-0.0301% (25 mil-CD)-0.0653
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (60 mil-MD)-0.0027% (60 mil-CD)-0.0142
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (60 mil-MD)-0.1500% (60 mil-CD)-0.0326
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (60 mil-MD)-0.0167% (60 mil-CD)-0.0377
Density (Specific Gravity)IPC-650-2.3.5g/cm32.77g/cm32.77
Specific HeatIPC-650-2.4.50J/g°C0.9J/g°C0.9
Thermal Conductivity (Unclad)IPC-650-2.4.50W/M*K0.85W/M*K0.85
CTE (X -Y axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C16-20ppm/°C16-20
CTE (Z axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C25ppm/°C25
Flammability RatingInternalV-0V-0

China RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm factory
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