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| Categories | Multilayer Printed Circuit Boards | 
|---|---|
| Brand Name: | TOPCBS | 
| Model Number: | High TG CCL 8Layer main board using in electric power | 
| Certification: | UL94V0 | 
| Place of Origin: | Suzhou China | 
| MOQ: | Negotiation | 
| Price: | Negotiation | 
| Payment Terms: | T/T | 
| Supply Ability: | 10000unit per month | 
| Delivery Time: | 10-14working days | 
| Packaging Details: | 20units per package box size 20*15*10cm | 
| Number of Layers:: | 8Layer | 
| Raw material: | TG170°C CCL | 
| Finished treatment: | Immersion gold | 
| Line width/space: | 100um/100um | 
| Drilling size: | 200um | 
| Board thickness: | 1.6mm | 
| BGA size: | 0.3mm | 
Multi Layer Printed Circuit Board Circuit PCB Wire Board Contract
Deciding on the right time to have a hybrid PCB build will mainly depend on the application's functions, the temperatures that will be present, the types of frequencies for the PCB, and the costs. One of the great aspects of hybrid builds is that it allows you to expand your creativity when it comes to developing the PCB that will have all the electrical and mechanical properties that are desired, which can provide more customized and tailored PCBs that are a better fit for the application.
Also, cost considerations will play an important factor with hybrid designs. Seeking a lower cost for the PCBs may be wanted yet could result in a lower quality circuit board that doesn't fulfill its desired functions. This problem is what will normally occur when only working with one type of PCB laminate. Instead, you can gain the cost advantages of having a cheaper material used in places that don't require higher functions or frequencies, and add smaller quantities of the higher-cost materials for greater mechanical, electrical and thermal properties in specific sections of the PCB.

Hybrid multilayer PCBs often make use of circuit materials with very different values of dielectric constant (Dk). For example, some multilayer antenna circuits may consist of a low-Dk circuit material as the outside layer for radiating elements, a moderate-Dk circuit material internally for a stripline antenna feed line, and a high-Dk material for an internal layer for filter circuitry. The different Dk materials are often based on different resin systems. The outer, low-Dk layer may be PTFE material while the inner, moderateDk circuit layer is formed on a ceramic-filled hydrocarbon-based laminate. The bonding materials could be based on either type of material, although hydrocarbonbased bonding materials are more often used for their ease of circuit fabrication.
2 . Specifications:
| Name | 8Layer main board / immersion gold | 
| Number of Layers | 8 | 
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 | 
| Material | IT180A + Rogers4350B + Copper Block | 
| Thickness | 2.0mm | 
| Min Track/Spacing | 100um/100um | 
| Min drill Size | 0.2mm | 
| Solder Mask | Green | 
| Silkscreen | White | 
| Surface Finish | Immersion gold | 
| Finished Copper | 1OZ | 
| Aspect ratio | 8:1 | 
3. Product application
Printed circuit boards (PCBs) with characteristic impedance control are widely used in high frequency circuit. PCB's that mixed high frequency material can reduce signal loss at high frequencies and meet the development needs of communication technology.
It is mainly used in the infrastructure field of transmission cores including WDM/OTN end-to-end intelligent optical transmission platform, MSTP/multi-service transmission platform, microwave fusion transmission radio frequency, data communication system platform, and other information communication industries.
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