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HDI Burn In Test PCB Circuit Board Contract Manufacturing

Categories Burn In Test PCB
Brand Name: TOPCBS
Model Number: BIB and test Boards
Certification: UL94V0
Place of Origin: Suzhou China
MOQ: Negotiation
Price: Negotiation
Payment Terms: T/T
Supply Ability: 10000unit per month
Delivery Time: 10-14working days
Packaging Details: 20units per package box size 20*15*10cm
Layer count: 8Layer
Raw material: IT180A
Finished Treatment: Immerion Gold + OSP
Pitch Size: 0.35mm
Board thickness: 0.8mm
Line width/space: 75um/100um
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HDI Burn In Test PCB Circuit Board Contract Manufacturing

12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board


In addition to the typical PCB design guidelines which are quite common among all PCB designers, there are a few additional factors for making a Burn in Board. One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board to fail before the device under test. Therefore, all active/passive components and connectors should comply with high-temperature requirements, and all materials and components should meet high-temperature and aging requirements.

1 . Descriptions:


What is a BIB ?


A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


2 . Specifications:


Name8Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers8
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialIT180
Thickness0.8mm
Min Track/Spacing75um/75um
Min Hole SizeLaser 75um
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold + OSP
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

China HDI Burn In Test PCB Circuit Board Contract Manufacturing factory
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