Product Details
Company Profile

Shorten Type UL94V-0 Micro SD Card Socket Middle Pin 1.5h TF Card Socket

Micro SD / TF card connector, shortened type, middle Pin 1.5H T-flash

Highlights

Low‑profile 1.5 mm total height, shortened-type compact footprint, middle‑pin layout for optimized PCB routing flexibility
Housing material LCP with UL94V‑0 flame retardant rating, satisfies fire‑safety requirement for industrial & smart hardware projects
Selective gold plating on contact area, stable signal transmission for UHS‑I micro SD / TF cards
SMT surface‑mount design, fully compatible with high‑volume automated reflow production line
Built‑in card‑detect switch, real‑time card presence identification for system firmware logic
RoHS‑compliant, stable mass‑supply capacity, support OEM / ODM pin‑layout & plating customization
Optimized mechanical retention force, anti‑mis‑insertion structure, reduce on‑site intermittent‑recognition failure risk

Specifications

Item	Specification
Product Type	Shorten‑type Micro SD / TF Card Socket, Middle‑Pin, SMT
Total Height	1.5 mm (Max)
Compatible Card	Standard Micro SD / TF Card (UHS‑I support)
Mounting Method	Surface‑Mount SMT
Operation Type	Non‑push‑push (direct insert‑pull)
Mating Life	Min 5 000 insertion‑ejection cycles (under normal load)
Card Detect Switch	Built‑in (NO / NC optional)
Coplanarity	≤0.10 mm
Retention Force	Suitable holding force to avoid loose card under mild vibration

Material & Electrical Characteristics

Item	Specification
Housing Material	High‑temperature LCP, UL94V‑0, Black color
Contact Terminal	Phosphor Bronze, selective Au plating over Ni base
Shell Material	Stainless Steel
Rated Current	0.5 A Max
Rated Voltage	12 V DC Max
Contact Resistance	≤100 mΩ (initial)
Insulation Resistance	≥1000 MΩ @ DC 500 V
Withstand Voltage	500 V AC for 1 minute
Signal Compatibility	SDIO / SPI interface, supports UHS‑I microSD card

Environmental & Soldering Guide

Item	Specification
Operating Temperature	‑25 ℃ ~ +85 ℃
Storage Temperature	‑40 ℃ ~ +90 ℃
SMT Reflow Profile	Peak temperature 260 ℃ max, dwell time ≤10 s at 255 ℃+; follow IPC/JEDEC standard
Humidity Resistance	5 %‑95 % RH, non‑condensing
Salt Spray	48 h (neutral salt spray test for plated parts)
Compliance	RoHS; UL94V‑0 flame retardant

As products become smaller, a minor external shock could cause short-circuit or misalignment. The hinge feature keeps the card stable, protecting it from external shocks and/vibrations.

Product Features

Ultra‑low 1.5 mm stacked height, shorten body size, save precious PCB enclosure Z‑axis & X‑Y space
Middle‑pin terminal assignment: flexible routing, easier differential signal layout, good for high‑speed SDIO/SPI signal integrity
LCP high‑temp plastic housing, UL94V‑0 flame retardant; withstands standard SMT reflow soldering temperature profile without deformation
Phosphor‑bronze contact terminals, selective nickel‑gold plating on contact interface; anti‑oxidation, lower contact resistance
Integrated card‑detect switch, supports hardware card‑insertion / removal detection for MCU logic judgment
Anti‑reverse‑insertion mechanical stop structure, prevents damage caused by wrong‑direction card insertion
SMT surface‑mount termination, fits mass‑production automatic pick‑and‑place equipment
Stainless‑steel shell for structural reinforcement & partial EMI shielding effect
Full compliance with RoHS environmental requirements; available for custom gold‑thickness, pin modification upon request

Typical Application

IoT smart devices: smart gateway, smart sensor terminal, edge‑collection node
Surveillance & security: IP camera, body‑worn camera, video recording equipment
Industrial embedded hardware: industrial control board, data‑logger, field monitoring unit
Consumer smart hardware: portable recorder, handheld instrument, mini‑POS terminal
Transportation‑related equipment: vehicle auxiliary recorder, onboard peripheral module
Medical‑related auxiliary equipment (non‑implant): portable diagnostic data‑recording device
Educational electronics, single‑board‑computer peripheral modules

Product Advantages

Middle‑pin layout differentiation: Most competing 1.5 H TF sockets use edge‑pin design; our middle‑pin layout releases PCB‑edge routing pressure, reduces signal‑trace crosstalk risk for high‑speed SDIO circuits, simplifies multi‑layer board layout work for hardware engineers.
UL94V‑0 LCP base as standard configuration: Many low‑cost alternatives adopt non‑V0 plastic; our default UL94V‑0 material helps customers pass product fire‑safety certification directly, eliminates extra material‑qualification workload.
Selective‑gold plating process: Gold only applied on critical contact zone instead of full‑part gold‑plating; balance reliable contact performance and BOM cost, avoid over‑expensive full‑gold solution.
Shorten‑type compact outline: Optimized outline dimension compared to standard‑length 1.5 H sockets; fit ultra‑slim enclosure design without sacrificing mechanical strength.
Stable mass‑production consistency: Strict coplanarity control ≤0.10 mm, lower soldering‑open‑circuit risk in SMT mass production; reduce after‑sales intermittent‑recognition complaints caused by poor coplanarity.
Flexible customization capability: Quick‑turn modification for card‑detect switch logic (NO/NC), gold thickness, partial pin omission; support pre‑sample before mass order for project validation.

FAQ

Q1: Does this socket support UHS‑I high‑speed micro‑SD cards, large‑capacity cards (128 GB / 256 GB)?

A: Yes. The socket follows micro‑SD mechanical & electrical specification; maximum card capacity depends on your host‑chip driver, not the socket itself. It works with UHS‑I micro-SD / TF cards under proper hardware design.

Q2: What is the difference between middle‑pin and edge‑pin 1.5 H TF socket?

A: Middle‑pin places solder pads away from the PCB edge; signal traces can route inward into the PCB, reducing edge‑area trace congestion. Edge‑pin puts all pads on board border. Choose middle‑pin when your PCB‑edge space is crowded or high‑speed SDIO signal integrity matters.

Q3: Can I use a normal‑temperature plastic‑version footprint for this UL94V‑0 socket?

A: Footprint is compatible mechanically, but plastic material is different. You must select the UL94V‑0 version if your end‑product needs fire‑safety certification.

Q4: My product has a vibration‑rich working environment; will card drop‑out happen?

A: Our socket has standardized retention force. For heavy‑vibration scenarios, the mechanical structure of the whole equipment should be optimized; we suggest doing vibration & shock validation tests in the prototype phase.

Q5: What is your lead‑time for sample and mass production?

A: Standard‑spec samples: 3‑7 working days. Mass‑production lead‑time depends on order quantity; we will provide a formal schedule upon receiving your BOM requirement. Custom‑modified version needs extra sample‑development cycle.

Q6: Can you adjust gold‑plating thickness or remove partial pins for a custom project?

A: Yes, OEM & ODM service is available. Please provide detailed requirements or send your drawing for evaluation.

Q7: What risk may happen if reflow soldering temperature exceeds 260 ℃ peak?

A: Excessive temperature may cause LCP housing deformation and terminal displacement, resulting in poor card‑contact or assembly failure. Please strictly follow our recommended soldering profile.

Product Tags:


*From:	Your email address is incorrect!
*To:	Shenzhen Xietaikang Precision Electronic Co., Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Categories	Card Connectors
Durability cycles:	5000 Cycles Min
Storage Temperature:	-10℃ to +85℃
Housing:	LCP,UL94V-0 black
Gender:	Female
Terminal:	copper alloy
Brand Name:	XTK
Model Number:	Micro sd / TF card connector
Certification:	CE/ROHS
Place of Origin:	Guangdong,China
MOQ:	1500pcs
Payment Terms:	L/C,T/T,Payyal
Supply Ability:	2KK pcs
Delivery Time:	5-7 days
Packaging Details:	inner package:in reel; Outer Package: reel in Carton
No. Of Positions:	9p