High Temperature Resistance JEDEC IC Trays For MEMS Sensor IC
ESD High Temperature Resistance JEDEC Trays With Different Cavity
Size For MEMS Sensor IC
Quick Detail:
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN1952 | Package Type | IC |
| Cavity Size | 10.2*8.5*2.9mm | Size | Customized |
| Material | PPE | Flatness | MAX 0.76mm |
| Resistance | 1.0x10e4-1.0x10e11Ω | Service | Accept OEM,ODM |
| Color | Black | Certificate | ROHS |
1. Support various sizes of customization
2. Good anti-static and high temperature resistance
3. All sizes meet the international JEDEC standard design
requirements
4. Conventional PPE and MPPO materials can meet the requirements of
high temperature resistance of 150°C
5. Have design experience of various small sizes and components
6. Experience in designing chip loading trays with various packaging
methods, such as BGA.QFN.QFP.SOP.SIC...etc
7. Different color trays can be customized
Small Question 1
Why the color of JEDEC tray is mainly black?
Answer
Generally, the demand of JEDEC Tray must meet the high temperature
resistance of 125~150°C, so most of our common black products, for
the requirements of different colors, because anti-static and high
temperature requirements are opposed, so most of the high
temperature resistant plates on the market are black.
Small Question 2
Why choose high temperature plastic JEDEC tray?
Answer
High temperature resistance can provide performance guarantee,
while protecting the chip to the greatest extent, it also realizes
the integration of automation equipment, which meets the high
temperature requirements of the equipment. Plastic products can be
recycled and reused many times, which is beneficial to
environmental protection while reducing transportation costs and
maximizing raw materials value.
JEDEC tray is compatible with JEDEC tray feeder, reducing manual
handling and loading and other processes, providing a complete
automation service for efficient production, realizing automatic
picking during assembly, avoiding damage to chips and avoiding
manual picking and chip oxidation.
The design of the structure and shape in line with JEDEC
international standards can also perfectly meet the requirements of
the carriing components or IC of the tray, carriing function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, improve work efficiency.
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
Color, temperature and other special requirements can be customized |
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is
the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD
