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High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module
High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module
Categories Thermal Camera Core
Pixel Pitch: 10μm
NETD: 20mK(F2); 25mK(F4)
Compact Size: 87×94×54.5mm
Brand Name: SensorMicro
Model Number: GAVIN GC1010HMG
Certification: ISO9001:2015; RoHS; Reach
Place of Origin: China
MOQ: 1 Piece
Price: Negotiable
Payment Terms: T/T
Weight: ≤460g
Resolution: 1024×768
Spectral Range: 3.7~4.8μm MW
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Company Info.
Wuhan SensorMicro Technology Co., Ltd
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High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

High Sensitivity Thermal Camera Core Cooled Camera Module 1024×768 / 10μm
Product Overview
The GAVIN GC1010HMG infrared camera core integrates a 1024×768/10μm HOT MWIR cooled infrared detector, offering a larger array and smaller pixels compared to the GAVIN GC615HMG, resulting in clearer imaging with finer details. Combined with next-generation image processing algorithms, it delivers stable, high-quality images, while HOT technology enables next-level SWaP optimizations with smaller and lighter design, and low power consumption.
As a leading thermal imaging module manufacturer, we provide customers with a wide variety of mature integration solutions. By using infrared camera modules, it is convenient for them to conduct secondary development and reduce their time of independent research and development.
Main Features
  • Superior Quality with Larger FPA and Smaller Pixel Size
    • Developed based on a 1024×768/10μm large-format HOT MWIR cooled infrared detector, delivering clear images and wide field of view
    • Equipped with next-generation image processing algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for superior image quality
    • Smaller 10μm pixel size provides higher spatial resolution and better signal-to-noise ratio
  • SWaP Optimization Leading by HOT Technology
    • Supports 150K high-temperature operation, with cooling time ≤ 4min
    • Compact size: 87×94×54.5mm, lightweight: 460g
  • Rich Interfaces, Easy Integration
    • Supports CameraLink/USB3.0/GigE/HDMI/SDI/MIPI/Fiber optic interfaces
    • Flexible RAW/YUV image output
Product Specifications
ModelGAVIN GC1010HMG HOT MWIR Cooled Infrared Camera Core
Resolution1024×768
Pixel Size10μm
Spectral Response3.7μm±0.2μm～4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F2)
25mK(F4)
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Analog VideoPAL/NTSC
Digital VideoStandard: DVP/LVDS/USB2.0
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply12V±1V
Steady Power Consumption(23℃)≤8W
Cooling Time(23℃)≤4min
Size(mm)87×94×54.5
Weight(g)≤460
Operating Temperature-40℃~+71℃
Lens OptionsFixed focus: 25mm/F2
Industrial Applications
The GAVIN GC1010HMG thermal infrared camera module is widely used in many areas such as NDT, Environmental Monitoring, Long-Range Surveillance, Scientific Research etc.
Our Advantages
  • High sensitivity and excellent performance
  • World-leading technology in infrared industry
  • Various infrared detectors available
  • Both uncooled and cooled IR detectors in different formats and pixel size
  • Volume production to ensure fast delivery
  • Three production lines with annual production capability up to millions of detectors
Frequently Asked Questions
1. What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.
2. What is WLP?
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.
3. What's the advantage of WLP?
WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. We are now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.
Product Tags:

640x512 Thermal Camera Core

  

RS058 Thermal Camera Core

  

900g Cooled Camera Module

  
China High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module factory

High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

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