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Green FR-4 HASL Lead Free Surface BGA PCB Assembly

Categories PCB Assembly Prototype
Brand Name: HNL-PCBA
Model Number: PCB Assembly
Certification: ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
Place of Origin: CHINA
MOQ: 1 PC
Price: Negotiable
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Delivery Time: 1-7days
Packaging Details: ESD packaging with carton box
Product name: PCB Assembly Prototype
Material: Fr-4, Fr-5, High-Tg, Aluminum Based , Halogen Free
Copper thickness: 0.3. 0.56 ..... 6oz
Max Board size: 700x610mm
Min. line spacing: 0.030mm
Board thickness: 0.3-3.5mm
Min. hole size: Laser 0.05mm ; Mechnical 0.15
Surface finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
Solder mask color: Blue.green.red.black.white.etc
Pcb assembly method: Mixed,BGA,SMT,Through-hole
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Green FR-4 HASL Lead Free Surface BGA PCB Assembly

Green FR-4 HASL Lead Free surface BGA Craft PCB Assembly Prototype


PCB Assembly Prototype Introduction


Prototype printed circuit board (PCB) assemblies also named surface-mount technology (SMT) PCB prototypes, PCBA prototype assembly, PCB sample assembly, etc.

The term prototype PCB Assembly refers to a fast prototype PCBA used to test the function of new electronic designs.

The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations.

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .


PCB CAPABILITIES


FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5Min Line Width/Space0.035mm/0.0350.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingHASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA CAPABILITIES


PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-

Our advantage


Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing


Delivery Time


Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

PCB Assembly Prototype Application Field


Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.



Workshop



Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box



China Green FR-4 HASL Lead Free Surface BGA PCB Assembly factory
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