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EP4SGX110DF29C4N 600MHz Electronics IC Chips

Categories Industrial Electronic Components
Brand Name: Intel / Altera
Model Number: EP4SGX110DF29C4N
MOQ: 1 pcs
Price: USD 1~999 pcs
Payment Terms: T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability: 498 pcs
Certification: Lead free / RoHS Compliant
Delivery Time: 3-5 Day
Packaging Details: International Standard Packaging
Category: Integrated Circuits (ICs)
Condition: Original 100%,Brand New and Original,New
Package / Case: FBGA-780
Number of I/Os: 372 I/O
Operating Supply Voltage: 900 mV
Data Rate: 600 Mb/s to 8.5 Gb/s
Maximum Operating Frequency: 600 MHz
Number of Transceivers: 8 Transceiver
Service: BOM Kitting
Lead time: In Stock,contact us
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EP4SGX110DF29C4N 600MHz Electronics IC Chips

EP4SGX110DF29C4N Industrial Electronic Components FBGA-780


Product AttributeAttribute Value
Intel
FPGA - Field Programmable Gate Array
Stratix IV GX
372 I/O
900 mV
0 C
+ 70 C
SMD/SMT
FBGA-780
Tray
Data Rate:600 Mb/s to 8.5 Gb/s
Series:Stratix IV GX
Brand:Intel / Altera
Maximum Operating Frequency:600 MHz
Moisture Sensitive:Yes
Number of Transceivers:8 Transceiver
Product Type:FPGA - Field Programmable Gate Array
Factory Pack Quantity:36
Subcategory:Programmable Logic ICs
Tradename:Stratix

Feature Summary


The following list summarizes the Stratix IV device family features:


■ Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devices supporting data rates up to

8.5 Gbps and 11.3 Gbps, respectively


■ Programmable transmitter pre-emphasis and receiver equalization circuitry to compensate for frequency-dependent losses

in the physical medium


■ Typical physical medium attachment (PMA) power consumption of 100 mW at 3.125 Gbps and 135 mW at 6.375 Gbps per

channel


■ 72,600 to 813,050 equivalent LEs per device


■ 7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory

and FIFO buffers


■ High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision

multipliers at up to 600 MHz


■ Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery clocks (PCLK) per device


■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+

SRAM on up to 24 modular I/O banks


■ High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic phase alignment (DPA), and soft-CDR circuitry at

data rates up to 1.6 Gbps


■ Support for source-synchronous bus standards, including SGMII, GbE, SPI-4 Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI,

UTOPIA IV, NPSI, and CSIX-L1


■ Pinouts for Stratix IV E devices designed to allow migration of designs from Stratix III to Stratix IV E with minimal PCB impact.


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