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| Categories | Multilayer PCBs | 
|---|---|
| Brand Name: | FASTPCBA | 
| Model Number: | PCB Manufacturer | 
| Certification: | ISO9001 / IATF16949 / ISO13485 | 
| Place of Origin: | China | 
| MOQ: | 1 | 
| Price: | 1-30 | 
| Payment Terms: | Advance TT, T/T | 
| Supply Ability: | 200000 | 
| Delivery Time: | 5-8 work days | 
| Packaging Details: | white pearl cotton (used around the inside of the carton) + carton | 
| Name: | 2oz 4 Layer Diy Multilayer Pcbs | 
| Keyword: | PCB Factory | 
| Number of layers: | 1-48 | 
| Laminate materials: | FR4, High TG FR4, High Frequency, Alum, FPC | 
| Board Thickness: | Single/Double:0.008±0.004” | 
| Outer Cu weight: | 0.5-4 0z | 
| Drill deviation: | ±0.002”(0.05mm) | 
| Sub-assembly: | Plastic,metal,screen | 
| Company Info. | 
| FASTPCBA Co., Ltd. | 
| View Contact Details | 
| Product List | 
Multilayer PCB Board Technology
The miniaturisation of electronic devices requires the implementation of more and more functionalities in less and less space. At the same time, the density of components on a circuit board is also increasing. Multilayer circuit boards with four or more copper layers are therefore used in almost all areas of electronics.
FASTPCBA can rewiring is possible on up to 30 layers, which are generally connected with plated through holes. Thicknesses of up to 3.20 mm are possible in PCB production.
Multilayer PCB Manufacturing Process
The main challenge with multilayer PCBs is to ensure the optimal
handling of the very thin layers of material. Continuously
automated production processes ensure consistent quality even with
high-layer multilayers.
Accurately designed registration processes guarantee maximum uniformity of all layers - even with the finest structures. The layer stack-up can be individually designed for many electrical requirements (EMC, impedance, etc.) using insulation thicknesses starting at 50 μm for cores and prepregs.
The resin filling and insulation thicknesses for the layer stack-ups are calculated by means of intelligent software. Cost and quality optimisation can also be achieved.
Surfaces
Chemical nickel/gold
Chemical tin
Electroplated nickel/gold
HAL or HAL lead-free
OSP
others on request
General technical specifications
* Solder resist masks
Photosensitive coating systems, thermal final curing
Colours: green, red, blue, glossy black, matt black, white, yellow
Non-photosensitive coating systems, purely thermosetting: white,
black
* Additional printing
Identification/assembly
Hole filler/through hole filler
Peelable solder mask
Heatsink
Carbon
* Edge plating
The end faces of the PCB contour can be plated in order to improve
the EMC protection of a PCB, make electrical contact with the
housing of the module or meet increased cleanliness requirements.
* Milled plated through holes
It is possible to produce application-specific components with
so-called milled plated through holes. Due to the possibility of
contact on the front side, the resulting PCBs can be soldered as
components to another board (interposer).
* Contour machining
Contour production: milling and scoring
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