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High Purity 99.5% Titanium Sputtering Target For Pvd Coating System

Titanium Sputtering Target 99.5%, 99.95% D100x40mm , D65x6.35mm

Purity is the main performance index of the target material, because the purity of the target material has a great influence on the performance of the film.

Main performance requirements of target material:

Purity is the main performance index of the target material, because the purity of the target material has a great influence on the performance of the film. However, in practical application, the purity requirements of the target are not the same. For example, with the rapid development of microelectronics industry, the size of silicon chip has been developed from 6 ", 8" to 12 ", while the wiring width has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um. Previously, 99.995% of the target purity can meet the process requirements of 0.35um IC, while the preparation of 0.18um line requires 99.999% or even 99.9999% of the target purity.

Impurities in the target solid and oxygen and water vapor in the pores are the main pollution sources. Different target materials have different requirements for different impurity content. For example, pure aluminum and aluminum alloy targets for semiconductor industry have different requirements for alkali metal content and radioactive element content.

In order to reduce the porosity in the target solid and improve the properties of sputtered films, the target is usually required to have a high density. The density of the target not only affects the sputtering rate, but also affects the electrical and optical properties of the film. The higher the target density is, the better the film performance is. In addition, increasing the density and strength of the target can make the target better withstand the thermal stress in the sputtering process. Density is also the key performance index of the target.

Generally, the target material is polycrystalline structure, and the grain size can be from micrometer to millimeter. For the same kind of target, the sputtering rate of the target with small grain size is faster than that of the target with large grain size, while the thickness distribution of the film deposited by the target with small grain size difference (uniform distribution) is more uniform.

Titanium Sputtering Target , Titanium Sputtering Target 99.95%

are available in varying sizes

D100x40mm , D65x6.35mm etc

Product Name	Element	Purirty	Melting Point ℃	Density (g/cc)	Available Shapes
High Pure Sliver	Ag	4N-5N	961	10.49	Wire, Sheet, Particle, Target
High Pure Aluminum	Al	4N-6N	660	2.7	Wire, Sheet, Particle, Target
High Pure Gold	Au	4N-5N	1062	19.32	Wire, Sheet, Particle, Target
High Pure Bismuth	Bi	5N-6N	271.4	9.79	Particle, Target
High Pure Cadmium	Cd	5N-7N	321.1	8.65	Particle, Target
High Pure Cobalt	Co	4N	1495	8.9	Particle, Target
High Pure Chromium	Cr	3N-4N	1890	7.2	Particle, Target
High Pure Copper	Cu	3N-6N	1083	8.92	Wire, Sheet, Particle, Target
High Pure Ferro	Fe	3N-4N	1535	7.86	Particle, Target
High Pure Germanium	Ge	5N-6N	937	5.35	Particle, Target
High Pure Indium	In	5N-6N	157	7.3	Particle, Target
High Pure Magnesium	Mg	4N	651	1.74	Wire, Particle, Target
High Pure Magnesium	Mn	3N	1244	7.2	Wire, Particle, Target
High Pure Molybdenum	Mo	4N	2617	10.22	Wire, Sheet, Particle, Target
High Pure Niobium	Nb	4N	2468	8.55	Wire, Target
High Pure Nickel	Ni	3N-5N	1453	8.9	Wire, Sheet, Particle, Target
High Pure Lead	Pb	4N-6N	328	11.34	Particle, Target
High Pure Palladium	Pd	3N-4N	1555	12.02	Wire, Sheet, Particle, Target
High Pure Platinum	Pt	3N-4N	1774	21.5	Wire, Sheet, Particle, Target
High Pure Silicon	Si	5N-7N	1410	2.42	Particle, Target
High Pure Tin	Sn	5N-6N	232	7.75	Wire, Particle, Target
High Pure Tantalum	Ta	4N	2996	16.6	Wire, Sheet, Particle, Target
High Pure Tellurium	Te	4N-6N	425	6.25	Particle, Target
High Pure Titanium	Ti	4N-5N	1675	4.5	Wire, Particle, Target
High Pure Tungsten	W	3N5-4N	3410	19.3	Wire, Sheet, Particle, Target
High Pure Zinc	Zn	4N-6N	419	7.14	Wire, Sheet, Particle, Target
High Pure Zirconium	Zr	4N	1477	6.4	Wire, Sheet, Particle, Target

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Categories	Sputtering Targets
Brand Name:	JINXING
Model Number:	Titanium Sputtering Target
Certification:	ISO 9001
Place of Origin:	China
MOQ:	1kg
Price:	20～200USD/kg
Payment Terms:	L/C, D/A, D/P, T/T, Western Union
Supply Ability:	100000kgs/M
Delivery Time:	10～25 work days
Packaging Details:	Plywood case
Material:	Titanium Sputtering Target
Process:	CIP, HIP Pressing
Size:	Customized
Application:	PVD Coating system
Shape:	Round , Plate, Tube
Grain Size:	Fine Grain Size, Good density
Purity::	99.5%， 99。95%
Density:	4.52g/cm3