6Layers 2nd order HDI Rigid Flex PCB FR4 / Polyimide Material ENIG Hasl OSP Surface Finish,rigid flex circuit boards,rigid flexpcb

Product Type: High Pixel Camera

Size: 12*6.80mm/1PCS

Productstructure: FR-4+TG170+Panasonic PI, four layers of soft shadow combination, minimum hole 0.15mm, plate thickness 1.60mm, nickel palladium gold 3U",

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Our Services

We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing. High quality,good price and service.

1. Delivery time:5-7days.
2. Certificates:UL,ISO9001,RoHS

Our capability

1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
4. ROHS compliant and lead-free process.
5. In-circuit, functional tests& burn-in tests, full system test
6. High output to guarantee prompt delivery.

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

Detailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers:	4~30 Layers(flex Pcb) and 4~80 (rigid flex)
Min Panel Size:	5mm x 8mm
Max Panel Size:	250 x 520mm
Min Finished board thickness:	0.05mm (1 sided inclusive copper)
Max Finished board thickness:	0.3mm (2 sided inclusive copper)
Finished board thickness tolerance:	±0.02~0.03mm
Material:	Kapton, Polyimide, PET
Base copper thickness (RA or ED):	1/3 oz, 1/2 oz, 1oz, 2oz
Base PI thickness:	0.5mil, 0.7mil, 0.8mil, 1mil, 2mil
Stiffner:	Polyimide, PET, FR4, SUS
Min Finished hole diameter:	Φ 0.15mm
Max Finished hole diameter:	Φ 6.30mm
Finished hole diameter tolerance (PTH):	±2 mil ( ±0.050mm)
Finished hole diameter tolerance (NPTH):	±1 mil ( ±0.025mm)
Min width/spacing (1/3oz):	0.05mm/0.06mm
Min width/spacing (1/2oz):	0.06mm/0.07mm
Min width/spacing (1oz):	Single layer: 0.07mm/0.08mm
	Double layer: 0.08mm/0.09mm
Aspect Ratio	6:01	8:01
Base Copper	1/3Oz--2Oz	3 Oz for Prototype
Size Tolerance	Conductor Width:±10%	W ≤0.5mm
	Hole Size: ±0.05mm	H ≤1.5mm
	Hole Registration: ±0.050mm
	Outline Tolerance:±0.075mm	L ≤50mm
Surface Treatment	ENIG: 0.025um - 3um
	OSP:
	Immersion Tin: 0.04-1.5um
Dielectric Strength	AC500V
Solder Float	288℃/10s	IPC Standard
Peeling Strength	1.0kgf/cm	IPC-TM-650
Flammability	94V-O	UL94

Quotation Requirement :
1) Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen:
f) Quantity

Shiping method:
1) By DHL, Fedex, UPS, TNT etc.
2) By sea if it is possible
3) By air

Surface treatment:
full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct		Advanced Technology
		2016		2017		2018
Max.Layer Count		26L		36L		80L
Through-hole plate		2～45L		2～60L		2～80L
Max.PCBSize(in)		24*52"		25*62"		25*78.75"
The layer number of FPC		1～36L		1～50L		1～60L
Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
Layeredplatelayer		2～12L		2～18L		2～26L
Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
Combination of hard and soft layers		3～26L		3～30L		3～50L
Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
HDI PCB		4～45L		4～60L		4～80L
Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
Build-up Material		FR-4		FR-4		FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
	MAX(mm)	3.5		10.0mm		10.0mm
Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
Gold thick		1～40u"		1～60u"		1～120u"
Nithick		76～127u"		76～200u"		1～250u"
Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
DieletricThickness		38(1.5)		32(1.3)		32(1.3)
		125(5)		125(5)		125(5)
SKipvia		Yes		Yes		Yes
viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
Laser Hole Filling		Yes		Yes		Yes
Technicalltem				Mass Product		Advanced Technolgy
				2017year		2018year	2019year
Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)				0.3		0.3	0.3
Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
		≦3mil		±0.60		±0.60	±0.60
Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
		Multi-layer overlay		N+N		N+N	N+N
				N+X+N		N+X+N	N+X+N
		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) circuit boards; product design, product development, software development, PCBA and FPCBA (SMT, post-weld, plug-in), processing and integrated production plants.

Factory set up history :

1982 the Japanese factory was established;

Zhe Jiang Factory
​Jiang Xi Factory 2006 Guangdong Shenzhen Division

2007 Dong Guan Factory

2010 Jiang Su, Si Chuan Factory

Chad Sheng’s business includes real estate, plastic, metals, LED, finance, high preision PCB equipment, chemicals, high precision PCB & FPC manufacture, More than 100 main customers are multi-national enterprise. Existing total factory area is more than 100,000 sqm. The capacities of PCB business are as below and the total turnover is over 30 billion RMB per year.

Double sided PCB 650,000 sqm/month

2L to 80L HDI with 1 to 4 layers

blind and buried PCB

& high layer-count PCB 160,000 sqm/month

Flexible Printed Ciccuit (FPC) 150,000 sqm/month

Chao Sheng can produce different kinds of PCBs such as :2-80 layers high layer count PCB

Flexible printed circuit, double-sided & multi-layer Aluminium PCB, ceramic PCB

1 to 4 layers blind & buried holes HDI PCB

Chao Sheng has Japan PCB & got the international certification such as UL, ISO9000, TS16949, ISO14000 AND QS8000. By use of modern technologies, IE, ERP and contemporary quality management systems and equipped with imported advanced precision equipments and production lines, Company’s objective “Global resources →Japan technology→create world class number one” can be achieved.

Our main customers are ABB, Omron, Seoul, Hua Wei, Ericsson, Toyota, Apple, Sony, Alco, BOE, Tongli, San Sheng, Samsung, LG, Fiber Home prod & after sales service, Emerson, etc. Many foreign and domestic famous enterprises build up their own brand name in the past years and have very good reputation. In order to fulfill customer’s step, Chao Sheng provides high end, middle end and low end products and services to customers. Our business philosophy - “better, faster and cost effective” are agreed by customers.

Company continues to concern environmental protection and clean production. We insist on continue developing strategy and stick on China and Global environmental convention. We have perfect environmental protection system and facilities which can treat waste, reduce waste and reduce energy. Company already achieved Guang Dong Province’s clean production requirement and exceed China (class 1) clean production requirement.

Base on our mission “To provide high quality PCB, on time and satisfactory services to the global electronic industry” and core system value “trust, mutual help, improvement, share customers are the core, markets are the trend” , Chao Sheng must achieve “to grow up to be first class PCB enterprise, and create value to customers, employees, society & share holers.”

Our goal is quality first, on time delivery, continuous improvement, customer satisfaction and provide first class services. We welcome all customers to visit our plants to give valuable comments, and hope to build up a long-term cooperation relationship.