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L-F HASL Surface Printed Circuit Board Assembly Fast Transceiver Motherboard PCBA

Categories PCBA Board
Brand Name: OEM and ODM
Model Number: SL81106S01
Certification: UL,RoHS, CE
Place of Origin: China
MOQ: 1pc
Price: Negotiable
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 100000pcs per day
Delivery Time: 5-7 days
Packaging Details: ESD package
Type: PCM/BMS/PCB
Surface Finishing: L-F HASL
Min.Line Width: 3mil
Features 1: Gerber/PCB file needed
Features 2: 100% E-test
Features 3: Quality 2 years guarantee
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L-F HASL Surface Printed Circuit Board Assembly Fast Transceiver Motherboard PCBA

pcba Board manufacturer Fast Fiber Optical Transceiver Motherboard PCBA


Product parameters


Indicators: 6, 1 power light, 2 fiber lights, 3 network port lights
Electrical port: RJ-45, 10/100Mbps (adaptive) Category 5 (up to 100m)
Optical port: can be equipped with ST/SC/FC, 100Mbps (full duplex)
Power Supply: 5V1A
Ambient temperature: -20 to +65°C
Storage temperature: -40~+80°C
Humidity: 5% to 90%


Files Requested For PCB Assembly Quotation


---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required


Shinelink kinds PCBA Product



94V0 PCBA manufacture Scale capabilities up to

We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly

SMT process (RoHs Compliant) Capabilities up to:

1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils

THT(Wave soldering) process (RoHs Compliant) Capabilities up to:


1.Single side wave soldering
2.SMT & THT mixture process


Module circuit boardTechnical capability


SMTPosition accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-SolderMax. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-SolderMetal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fitPress range:0-50KN
Max. PCB size:800X600mm
TestingICT,Probe flying,burn-in,function test,temperature cycling

PCBA Picture


China L-F HASL Surface Printed Circuit Board Assembly Fast Transceiver Motherboard PCBA factory
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