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| Categories | Flexible Printed Circuit Board | 
|---|---|
| Brand Name: | OEM / ODM | 
| Model Number: | SL80903S003 | 
| Certification: | UL, ROhs | 
| Place of Origin: | China | 
| MOQ: | 1pc | 
| Price: | Negotiation | 
| Payment Terms: | T/T, Western Union, MoneyGram,Paypal | 
| Supply Ability: | 10000 Piece/Pieces per Day | 
| Delivery Time: | 5-7 days | 
| Packaging Details: | ESD Bag | 
| Item: | FPC Flex Cable | 
| Material: | PI/PET/PEM/FR-4 | 
| Assembly service: | Provided | 
| Features 1: | Gerber/PCB file needed | 
| Features 2: | 100% E-test | 
| Features 3: | 3 years guarantee | 
Flexible flat FPCB cable Customization FPC supplier best price
Shinelink Service
EMS-electronic manufacturing service
PCB supply and layout
PCB assembly on SMT, BGA and DIP
Cost effective components sourcing
Fast turn prototype and mass production
Box build assembly
Engineering supported
Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)
| Materials | Standard | Advanced | 
| FR4 (130‐180 Tg by DSC) | Y | Y | 
| Halogen Free | Y | Y | 
| BT Epoxy | Y | Y | 
| Getek | Y | Y | 
| Isola 370HR 406 408 IS410 IS 420 IS620 | Y | Y | 
| Nelco 4000 | Y | Y | 
| Rogers 4000 | Y | Y | 
| PTFE | Y | Y | 
| Dupont Pyralux | N | Y | 
| Aluminum Core | Y | Y | 
| Surface Finishes | ||
| ENIG | Y | Y | 
| Flash Gold | Y | Y | 
| Electrolytic Nickel/Hard Gold | Y | Y | 
| HASL | Y | Y | 
| Lead Free HASL | Y | Y | 
| Immersion Ag | Y | Y | 
| Standard Features | Standard | Advanced | 
| Maximum layer count | 20 | 36 | 
| Maximum Panel Size | 21″x24″ | 24″x30″ | 
| Outer Layer Trace/Spacing (1/3 oz) | 0.0035″/0.0035″[90μm/90μm] | 0.0025″/0.003″[64μm/76μm] | 
| Inner Layer Trace/Spacing (H oz) | 0.003″/0.003″ [76μm/76μm] | 0.002″/0.0025″ [50μm/64μm] | 
| Maximum PCB thickness | 0.125″[3.2mm] | 0.177″[4.5mm] | 
| Minimum PCB thickness | 0.008″[0.20mm] | 0.004″[0.10mm] | 
| Minimum mechancial drill size | 0.008″[0.20mm] | 0.004″[0.10mm] | 
| Maximum PCB aspect ration | 10:01 | 12:01 | 
| Maximum copper weight | 5 oz [178μm] | 6 oz [214μm] | 
| Minimum copper weight | 1/3 oz [12μm] | 1/4 oz [9μm] | 
| Minimum core thickness | 0.002″[50μm] | 0.0015″[38μm] | 
| Minimum dielectric thickness | 0.0025″[64μm] | 0.0015″[38μm] | 
| Minimum Pad Size over Drill | 0.018″[0.46mm] | 0.016″[0.4mm] | 
| Solder Mask Registration | +/‐ 0.002″[50μm] | +/‐ 0.0015″[38μm] | 
| Mimimum Solder Mask Dam | 0.003″[76μm] | 0.0025″[64μm] | 
| Copper feature to PCB edge | 0.015″[0.38mm] | 0.010″[0.25mm] | 
| Tolerance on overall dimensions | +/‐ 0.004″[100μm] | +/‐ 0.002″[50μm] | 
| HDI Features | ||
| Immersion Tin | Y | Y | 
FPCB Picture

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