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| Categories | SMT PCB Assembly | 
|---|---|
| Brand Name: | KAZ Circuit | 
| Model Number: | PCBA-B-041 | 
| Certification: | ISO9001, TS16949, UL, RoHS | 
| Place of Origin: | China | 
| MOQ: | 1 pc | 
| Price: | USD/pc | 
| Payment Terms: | T/T, Western Union, Paypal | 
| Supply Ability: | 20,000 Square Meters / Month | 
| Delivery Time: | 2~3 weeks | 
| Packaging Details: | Bubble Wrap | 
| Layers: | 2 layers | 
| Board Thickness: | 1.6mm | 
| Copper: | 1oz | 
| Surface: | HASL LF | 
| Soldmask: | Green | 
| Silk Screen: | White | 
| Company Info. | 
| ShenZhen KaiZhuo Electronic Technology Co.,Ltd | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
2 Layers SMT PCB Assembly pcba board Prototype Service Green
Soldmask White Silk Screen
Detail Specifications:
| Layers | 2 | 
| Material | FR-4 | 
| Board Thickness | 1.6mm | 
| Copper Thickness | 1oz | 
| Surface Treatment | HASL LF | 
| Soldmask & Silkscreen | Green & White | 
| Quality Standard | IPC Class 2, 100% E-testing | 
| Certificates | TS16949, ISO9001, UL, RoHS | 
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since
2007, also provide PCB Assembly service for our customers. Now with
about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We
are confident to provide you quality products with factory-directed
price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month | 
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) | 
| Board Thickness | 0.3~4.0mm | 
| Layers | 1~20 layers | 
| Material | FR-4, Aluminum, PI | 
| Copper Thickness | 0.5~4oz | 
| Material Tg | Tg140~Tg170 | 
| Max PCB Size | 600*1200mm | 
| Min Hole Size | 0.2mm (+/- 0.025) | 
| Surface Treatment | HASL, ENIG, OSP | 
SMT Capacity
SMT PCB
assemblyrefers to the process of manufacturing a printed circuit board
(PCB) using surface mount technology, where electronic components
are placed and soldered directly to the PCB surface rather than
inserted through holes.
Key aspects of SMT PCB assembly include:
Component placement:
SMT components such as resistors, capacitors, integrated circuits
(ICs) and other surface mount devices are placed directly on the
PCB surface using automated pick and place machines.
Precise component placement is critical to ensure accurate
alignment and reliable electrical connections.
Solder paste deposition:
Solder paste is a mixture of solder alloy particles and flux that
is selectively deposited on the copper pads of a PCB using stencil
printing or other automated processes.
Solder paste acts as an adhesive and conductive material that will
form the electrical connection between the components and the PCB.
Reflow soldering:
After the components are placed, the PCB assembly goes through a
reflow soldering process that heats the board in a controlled
environment to melt the solder paste and form electrical and
mechanical connections between the components and the PCB.
Reflow profiles including temperature, time and atmosphere are
carefully optimized to ensure reliable solder joints.
Automatically detect:
After the reflow process, PCB assemblies are automatically
inspected using a variety of techniques, such as optical
inspection, X-ray inspection, or automated optical inspection
(AOI).
These inspections help identify and correct any problems such as
soldering defects, component misalignment or missing components.
Testing & Quality Control:
Comprehensive testing, including functional, electrical, and
environmental testing, is performed to ensure that PCB assemblies
meet required specifications and performance standards.
Implements quality control measures, such as statistical process
control and failure analysis, to maintain high manufacturing
standards and product reliability.
The advantages of SMT PCB assembly:
Higher Component Density: SMT components are smaller and can be placed closer together, resulting in a more compact, smaller PCB design.
Improved reliability: SMT solder joints are more resistant to vibration, shock and
thermal cycling than through-hole connections.
Automated manufacturing: The SMT assembly process can be highly automated, increasing production efficiency and reducing manual labor.
Cost-Effectiveness: SMT assembly can be more cost-effective, especially for high-volume production, due to reduced material and labor costs.
SMT PCB assembly applications:
Consumer Electronics: Smartphones, Tablets, Laptops, and Other Portable Devices
Industrial electronics: control systems, automation equipment and power electronics equipment
Automotive electronics: engine control units, infotainment and safety systems
Aerospace and defense: avionics, satellite systems and military equipment
Medical devices: diagnostic equipment, implantable devices and portable healthcare
solutions
SMT PCB assembly is a foundational technology used to produce compact, reliable,
and cost-effective electronic devices in a variety of industries.
Portable power stations usually include the following major components:
Battery pack: Provides primary power storage, typically consisting of lithium-ion batteries. The PCB requires a battery management system (BMS) to monitor the battery status and protect the battery from overcharge/overdischarge.
Inverter circuit: Converts the battery's DC power into AC power output to power various devices. An inverter circuit requires components such as inductors, capacitors and power semiconductor devices.
Charging circuit: Responsible for charging the internal battery pack and supports multiple input sources such as AC power and solar panels. Charging circuit includes switching power supply, current sensing, temperature monitoring, etc.
Input/output connectors: Provides USB ports, DC outlets, and other connectors for
connecting and charging external devices. The interface module
requires voltage regulation and protection circuits.
Control circuit: manages the overall operation of the power plant, including battery status monitoring, output power control, display driver, etc. Often implemented using a microcontroller.
Thermal Design: Consideration of the heat generated by power supply components requires careful PCB layout to establish appropriate thermal paths.
Portable power station PCB design requires balancing factors such as battery capacity, output
power, size, and weight. It requires well-coordinated circuit
topology and layout design with a strong emphasis on safety.
Photoes of this PCB, PCBA service, one stop Electronic
manufacturing service PCB Assembly for Audio products




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