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| Categories | PCB Prototype | 
|---|---|
| Brand Name: | OEM and ODM | 
| Model Number: | SL80815S002 | 
| Certification: | UL,RoHS, CE | 
| Place of Origin: | China | 
| MOQ: | 1pc | 
| Price: | Negotiable | 
| Payment Terms: | T/T, Western Union, MoneyGram,Paypal | 
| Supply Ability: | 1000pcs per day | 
| Delivery Time: | 5-7 days | 
| Packaging Details: | ESD package | 
| Copper thickness: | 4OZ | 
| Surface finish: | Immersion Tin, Silver | 
| Certificate: | UL, RoHS | 
| Features 1: | Gerber/PCB file needed | 
| Features 2: | 100% E-test | 
| Features 3: | Quality 2 years guarantee | 
Thick copper 4OZ FR4 printed circuit board Prototype Immersion Tin / Silver
4OZ FR4 PCB Specifications
Thick copper printed circuit board
a). Impressive Quality
b). Fast Lead Time
c). Good Service
Thick copper printed circuit board
Process Capability  | ||
ltem  | Mass Production  | Prototype  | 
Surface Treatment  | HASL(LF)  | HASL(LF)  | 
Immersion Gold  | Immersion Gold  | |
Flash Gold  | Flash Gold  | |
OSP  | OSP  | |
Immersion Tin  | Immersion Tin  | |
Immersion Silver  | Immersion Silver  | |
HASL&Gold Finger  | HASL&Gold Finger  | |
selective nickel  | selective nickel  | |
HASL(LF)  | smt Pad:>3um  | smt Pad:>4um  | 
Big Cu:>lum  | Big Cu:>l.5um  | |
Immersion Tin  | 0.4-0.8um  | 0.8-1.2um  | 
Immersion Gold  | Ni:2-5urn  | Ni:3-6urn  | 
Au:0.05-0.10um  | Au:0.075-0.15um  | |
Immersion Silver  | 0.2-0.6um  | 0.3-0.6um  | 
OSP  | 0.1-0.4um  | 0.25-0.4um  | 
Flash Gold  | Ni:3-6urn  | Ni:3-6urn  | 
Au:0.01-0.05um  | Au:0.02-0.075um  | |
Laminates  | CEM-3,PTFE  | CEM-3,PTFE  | 
FR4 (HighTG etc)  | FR4(HighTG etc)  | |
Metal Base(AL,CUetc)  | Metal Base(AL,CUetc)  | |
Rogors,etc  | Rogors,etc  | |
MAX.Layers  | 12(Layers)  | 40(Layers)  | 
MAX.Board Size  | 20"X48"  | 20"X48"  | 
Board Thickness  | O.4mm~6.0mm  | <O.4mm or >8.0mm  | 
Max.Copper Thickness  | inner Layer:16oz  | inner Layer:16oz  | 
Outer Layer:16oz  | Outer Layer:16oz  | |
Min.Track Width  | 3mil/0.075mm  | 3mil/0.075mm  | 
Min.Track Space  | 3mil/0.075mm  | 3mil/0.075mm  | 
M.in Hole Size  | 8mil/0.2mm  | 6mil/0.1mm  | 
M.in Laser Hole Size  | 4mil/0.1mm  | 3mil/0.076mm  | 
PTH Wall Thickness  | 0.8mil/20um  | 1.2mil/30um  | 
PTH Dia.Tolerance  | ±2mil/±50um  | ±2mil/±50um  | 
Aspect Ratio  | 12:1  | 15:1  | 
lmpedance Control  | ±5%  | ±5%  | 
PCBA Technology Capability
· Smallest chip placement:0201
· Automated axial insertion and Automated radial insertion
· Computer controlled Pb free wave soldering system
· High speed Pb free surface mount production lines
· Providing electronic components purchase service for the customers
· ICT on line inspection, PCBA function test equipment, Visual inspection
Mould And Box build Service
· Box Build
· Plastic injection
· Finish Packaging
PCB Picture

                                 
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