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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF100-40-11S
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 days
Packaging Details: 1000pcs/bag
Products name: Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules
Thermal conductivity: 4.0W/m-K
Hardness: 45±5 Shore 00
Operating Temp: -40-160℃
Keywords: Cpu Thermal Pad
Specific Gravity: 3.28 g/cc
Dielectric Constant(@ 1MHz): 4.75
Flame Rating: 94-V0
Sample: Sample free
Application: Gpu RDRAM Memory Modules
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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules


The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 4.0W/mK

> Outstanding thermal performance

> Broad range of hardnesses available
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)


Typical Properties of TIF®100-40-11S Series
ColorGrayVisual
ConstructionCeramic filled silicone elastomer******
Thickness Range(inch/mm)0.020~0.20inch(0.5mm~5.0mm) ASTM D374
Density(g/cc)3.28 g/ccASTM D792
Hardness45±5 Shore 00ASTM 2240
Recommended Operating Temperature(℃)-40 to 160℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant @ 1MHz4.75ASTM D150
Volume Resistivity≥1.0X1012 Ohm-meterASTM D257
Flame rating94-V-0UL94(E331100)
Thermal conductivity4.0 W/m-KASTM D5470
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Company profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

China Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules factory
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