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STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

Categories Copper Shielding Foil
Brand Name: JIMA
Model Number: EDCUSTD
Certification: SGS, ISO,Reach, RoHS
Place of Origin: china
MOQ: 100kg
Price: usd 15-20 kg
Supply Ability: 1000 Ton per month
Delivery Time: 5-15 days
Packaging Details: wooden carton
Purity: 99.8%
pinholes: None
Anti oxidation: 200 degree 60 minutes, 180 days 23 degree
Thickness: 1/2 oz,3/4 oz,1 oz,2 oz,3 oz,
Color: red or gray
Elongation: ≥ 2%
tensile strength: ≥ 150 MPa
peel strength: ≥ 1 N/mm
Company Info.
JIMA Copper
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STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

STD electrodeposited electrolytic ED copper foil (Standard electrodeposited electrolytic ED copper foil )


Features:

1.the treated foil in gray or red

1.High peel strength

3.Good etch ability

4.Excellent adhesion to etching resist

Application:

1. Phenolic resin board

2. Epoxy board

3. shielding


Typical properties of Standard copper foil for phenolic resin board and epoxy board.


Classification


UnitRequirementTest Method
Foil Designation/THM123IPC-4562A
Nominal thickness/12um1/2 OZ3/4 OZ

1

OZ

2

OZ

3

OZ

IPC-4562A
Area Weightg/㎡107±4153±5228±8285±10580±15860±20

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤6≤8≤10≤10≤15≤20
Tensile Strength

R.T.(23℃)


Mpa≥150≥220≥235≥280≥280≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)


≥2≥3≥3≥4≥4≥4

IPC-TM-650

2.3.18

SubjectΩ.g/㎡≤0.170≤0.166≤0.162≤0.162≤0.162≤0.162

IPC-TM-650

2.5.14

Peel Strength(FR-4)N/mm≥1.0≥1.3≥1.6≥1.6≥2.1≥2.1

IPC-TM-650

2.4.8

Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180/
H.T.(200℃)Minutes60/

1. Standard Width,1295(±1)mm,May according to the customer request tailor.

2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

China STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board factory
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