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Categories | High Frequency PCB |
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Brand Name: | XCE |
Model Number: | XCEM |
Certification: | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin: | China |
MOQ: | 1pcs |
Price: | negotiation |
Payment Terms: | T/T,Western union |
Supply Ability: | 1, 000, 000 PCS / week |
Delivery Time: | 5-10 days |
Packaging Details: | inner: vacuum-packed bubble bag outer: carton box |
Material: | Rogers |
Layer: | 6 |
Color: | Green |
Min line space: | 4mil |
Min line width: | 4mil |
Copper thickness: | 1OZ |
Board size: | 79*99mm |
Panel: | 1 |
Surface: | ENIG |
Blue Soldermask multi layer pcb Board , Min Line Width 4Mil Electronic printed circuit board
Typical Applications:
6 Layer Blue Soldermask High Frequency PCB Board Min Line Width 4Mil Electronic Board
Antenna Radio FM Rogers 3003 High Frequency PCB With Half Hole In
0.79mm Thickness
Advantage
6 Layer Blue Soldermask High Frequency PCB Board Min Line Width
4Mil Electronic Board
The basic characteristics of high-frequency substrate material
requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable,
usually the smaller the better the signal transmission rate and the
dielectric constant
Of the square root is inversely proportional to high dielectric
constant likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the
quality of signal transmission, the smaller the dielectric loss so
that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as
possible, because inconsistencies in the change in the cold and
heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in
the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength,
peel strength, etc. must also be good.
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |
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