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High Precision PCB Fabrication Blind Buried PCB ENIG Circuit Board

Categories Turnkey PCB Assembly
Brand Name: HUASWIN
Model Number: HSPCBA1208
Certification: ISO/UL/RoHS
Place of Origin: China
MOQ: 1 sets
Price: Negotiation
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Delivery Time: 15-20 working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
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High Precision PCB Fabrication Blind Buried PCB ENIG Circuit Board


High Precision Turnkey PCB Assembly Service with Blind/Buried PCB ENIG circuit board


Welcome to Huaswin!


Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

assembly ,IC pre-programming / burning on-line, testing, packing.



PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test


PCB Assembly services:


SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection



Through-hole Assembly


Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material


Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing


ISO Certification:
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!

China High Precision PCB Fabrication Blind Buried PCB ENIG Circuit Board factory
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