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2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression

Categories Multilayer PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Min line space: 0.2mm
Min line width: 0.2mm
Copper thickness: 2OZ
Size: 8*6cm
Board THK: 1.2MM
Panel: 1
Surface finish: ENIG+Gold plated
Color: green
Material: FR4 High TG
Model: XCEM
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2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression

2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression


Specification:


Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.


Parameter:


PCB parameter
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
China 2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression factory
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