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| Categories | Multilayer PCB | 
|---|---|
| Brand Name: | XCEPCB | 
| Model Number: | XCEPCBR | 
| Certification: | CE,FCC,ISO9008,SGS,UL | 
| Place of Origin: | CHINA | 
| MOQ: | 1pcs | 
| Price: | USD 0.1-10 | 
| Payment Terms: | Western Union,, T/T | 
| Supply Ability: | 1000000PCS/per week | 
| Delivery Time: | 3-12 days | 
| Packaging Details: | Inner:Vacuum packed bubble bag Outer:Carton box / mentioned is standard packing method,unless otherwise specified. | 
| Material: | FR4 PCB | 
| Color: | GREEN | 
| Size: | 13*13cm | 
| Surface: | HASL | 
| Board THK: | 1.6mm | 
| Copper THK: | 1OZ | 
High Quality FR4 Multilayer PCB For Air Condition Controller
Manufacturer
1.1L aluminum PCB;
2.good quality,reasonable price;
3.quicker delivery;
4.better logistic service;
5.UL,SGS,ROHS,ISO9000
-- PCB Manufacturing Services
High quality PCB manufacturing
Military, space and commercial applications
Wide array of substrates
Small prototype runs
Large scale production runs
ENIG, Immersion Silver, Lead Free HASL
Edge plating, plated slots
Blind / Buried vias
Fast turn times
reasonable prices!
-- Good Quality: UL, SGS Test, RoHS Certification
-- 1-20 layer: FR-4 matirial
-- Lead time: 3-12 days
-- competitive Price
| Item | Specification | ||
| Material | FR-4 / Hi-Tg FR-4 / Lead free Materials(RoHS Compliant)/CEM-3/CEM-1/Aluminium | ||
| Layer | single layer,double layer,multi-layer(4-10) | ||
| Board Thickness | 0.3mm-3.0mm,+/-0.1mm(tolerance) | ||
| Copper Thickness | 1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5% | ||
| Impedance Control | ±10% | ||
| Bow and Twist MAX. | 0.75%(SMT) | ||
| Anti-strip | 0.88N/mm | ||
| Resistance | ≤20Ω | ||
| Reactance | 500V | ||
| Min. Value | |||
| Min. Trace/Space Width | 6 mil,+/-0.15mm(tolerance) | ||
| SMD Pitch | 10 mil | ||
| BGA Pitch | 20 mil | ||
| Min Pad Space | 4mil(SMT) | ||
| Plating Copper Thickness | 15um | ||
| Hole | |||
| Hole Size | 0.25mm--6.2mm | ||
| Hole Position Tolerance | ±0.1mm | ||
| PTH/NPTH Tolerance | ±0.15mm(dia.=0.4-1.4mm) | ||
| Pad Tolerance | ±0.1mm(dia.≥0.6mm) | ||
| Pad to hole/to pad Tolerance | ±0.05mm/±0.2mm | ||
| Solder Mask | |||
| Pad no Open | soldermask must cover all on both side, reject tin on pad  | ||
| Pad Open | reject soldermask inside the hole on both side  | ||
| Solder Mask Thickness | 0.7mil,raised H≤0.05  | ||
| Colour | green,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved) | ||
| Surface Finish | |||
| HAL | tin height≤0.05mm  | ||
| ENIG | Nickel 3-7um,gold:0.5-0.7um | ||
| OSP/flash gold | 0.2-0.5um | ||
| Pealable mask | cover all on pad,thickness≥0.20mm  | ||
| Carbon Ink | cover all on trace,Value≤30Ω  | ||
| Outline | |||
| Outline Tolerance | ±0.2mm | ||
| Beveling | 30°,45° | ||
| V-cut position/depth | ±0.2mm(length≤100mm)/±0.2mm | ||
| Punch | ±0.1mm | ||
| E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) | ||
| Certificate | SGS,ISO,ROHS,UL, | ||


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