Categories | Lead Free PCB |
---|---|
Brand Name: | ACCPCB |
Model Number: | P11032 |
Certification: | ISO, UL, SGS,TS16949 |
Place of Origin: | China |
MOQ: | 1PCS |
Price: | Negotiable |
Payment Terms: | L/C / D/P / T/T / Western Union / Paypal |
Supply Ability: | 30,000SQ.M/Month |
Delivery Time: | 10days |
Packaging Details: | Vacuum packing with desiccant |
Thickness: | 1.50mm |
Surface Finish: | Immersion Gold |
Size: | 90mmX180mm |
Color: | Green Solder Mask |
Service: | OEM Services Provided |
Testing: | 100% E-Testing,100% AOI |
OEM 10layer Lead Free PCB AOI Inspection 1.0 Oz Copper Thickness and size 100mmX180mm
Production Feature:
Layer : | 10 Layers |
Base Material : | FR4 Tg150 |
Copper Thickness : | 1.0oz in all layer |
Board Thickness : | 1.50 mm |
Surface Finish : | Immersion gold |
Min. Hole Size : | 6 mil, 0.15mm |
Min. Line Width : | 4/4 mil, 0.10/0.10 mm |
Min. Line Spacing : | 4/4mil, 0.10/0.10mm |
Application : | electronic device |
Certification : | ISO9001, UL, ROHS,TS16949 |
Technology Capability:
Items | Technical Capability | ||
Layers | 1-28 layers | Min. line width/space | 4mil |
Max.board size (single&doule sided) | 600*1200mm | Min.annular ring width: vias | 3mil |
Surface finish | HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm |
Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
Base copper thickness(Inner and outer layer) | Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
Finished copper thickness | Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ | Max.board thickness(single&doule sided) | 3.20mm |
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
Advantages :
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949,
OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D
microscope
▪ Fast response within 24 hours
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008
standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying
Probe,e-Testing, X-ray Inspection, AOI (Automated Optical
Inspector) .
1.4.Dedicated quality assurance team with failure case analysis
process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;